Garras para obleas SWG para la fabricación de células

Vacuum Technology for Cell Manufacturing

The wafers produced in wafer manufacturing are processed further to solar cells. For this purpose, the wafers are doped and surface-treated so that the cells can later convert solar energy into electrical energy. Generally, phosphorous is diffused in the wafers to create the p-n junction. After the edges have been insulated, the plasma coating process gives the cells their signature characteristic blue color.

Then electrical contacts are applied to both the front and back of the cells using a screen printing process. These contacts are later used to conduct the electricity generated out of the cells.

Requirements for Vacuum Technology

High output quantities
Cell manufacturing also requires handling cycle times of less than one second. Because of the high acceleration rates, the grippers must apply high holding and shear forces. What’s more, the wafer gripper SWGm can integrate inspection and testing tasks during handling by using the optional integrated sensors.

Low breakage rates
The breakage rate of the processsignificantly affects the output quantities. For that reason, there is a high focus on handling the cells as gently as possible. The special gripper SWGm enables minimum breakage rates compared to other handling technologies. The large contact surface and low vacuum level mean that the gripper generates only minimum surface pressure, making it particularly gentle.

Contamination-free handling
Contamination of the cell surfaces must be avoided throughout many processes in the production chain. Because marks or contaminations have a negative effect on the chemical processes, particularly before the plasma coating process. The wafer gripper SWGm with a contact surface made of contamination-free PEEK material is the optimal solution. Suction cups made of the markless material HT1, can also be used in cell manufacturing.

Separating the cells
Separating the cells places high demands on the gripping technology. The floating suction cup SBS generates a high flow rate, which is used to achieve a larger engamenet distance to separate the cells. The optional floating suction cup modules SBSm, which can be integrated into the wafer gripper SWGm, allow the advantages of the wafer gripper to be combined with the engagement distance of floating suction cups. Sensors on the wafer gripper SWGm not only allow coverage monitoring, distance measurements and breakage detection, but also detect when two cells have been picked up. Detecting double layers during destacking processes reduces cycle times considerably.

Contacto

Schmalz Inc.
5850 Oak Forest Drive
Raleigh NC 27616
Estados Unidos de América

Tel. +1 919 713-0880
Fax +1 919 713-0883
schmalz@schmalz.us
Tarjeta de visita

Productos de base para la fabricación de células

Garras para obleas SWGm

  • Dimensiones: 125 x 125 mm y 156 x 156 mm
  • Modelo básico con escape axial o lateral
  • Material superficie de ventosa: PEEK

Sensor de doble capa DLD

  • Tiempo de respuesta: 10ms
  • Tensión: 24V-DC

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Módulo de ventosa flotante SBSm

  • Salto de altura: hasta 12,3 mm
  • Fuerza de retención: 1,3 N

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Ventosas flotantes SBS

  • Diámetro: 20 a 120 mm
  • Fuerza retención: 2,0 a 104,0 N
  • Tampón de elastómero casi sin huellas en la cara inferior de la ventosa

Ventosas planas SGPN

  • Diámetro: 15 a 40 mm
  • Material: FPM, HT1, NK, SI
  • Ventosa insertada en la boquilla

Ventosas de fuelle FG19

  • Diámetro: 19 mm
  • Material: HT1, NK, SI
  • Ventosa encajada en la boquilla

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Eyectores compactos SCPi Solar

  • Capacidad de aspiración hasta 145 l/min
  • Máx. vacío 51,5%
  • Función de ahorro de aire y IO-Link integrado

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