• Process-safe handling of printed circuit boards and drilled PCBs
  • Simple separation of intermediate layers during loading and unloading of wet process equipment (e.g. final cleaning)
  • Use in the handling of inner layers for multilayers
  • Low-contact gripping of sensitive workpieces such as thin copper foils and substrates
  • Gentle handling of workpieces with slightly structured surfaces
제품 하이라이트
  • Operation without ejector due to integrated vacuum generation according to the Bernoulli principle
  • Low-contact handling due to "floating" suction cup on an air cushion
  • High leakage compensation thanks to high flow rate at low vacuum
  • Safe separation of thin, porous workpieces
  • Protection against uncontrolled electrostatic discharge by elastomer buffer made of NBR-ESD
플로팅 흡입 컵 SBS-ESD
  • Connection via four mounting threads on the top (1); vertical (2) and horizontal compressed air connection
  • Conductive aluminium base body with integrated Bernoulli nozzle (3)
  • Flow element (4) in two versions: standard flow (SF) for dense to slightly porous parts and high flow (HF) with higher leakage compensation for porous parts
  • Dissipative elastomer buffers made of special material NBR-ESD on the underside of the suction cup (5)
  • Optionally with central support (SBS-40 and SBS-60)
  • Vacuum (A), exhaust air (B)
  • Diameter: 10 to 60 mm
  • Holding force: 1.4 to 18.5 N
  • Rubber buffer to protect against uncontrolled electrostatic discharge
미터법       장엄한


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