Vacuum Technology for the Solar Industry

Requirements for Vacuum Technology

High output quantities
Wafer manufacturing requires cycle times of less than one second. Because of the high acceleration rates, the grippers must apply high holding and shear forces. What’s more, using the wafer gripper SWGm can integreate inspection and testing tasks during handling by using the optional integrated sensors.

Low breakage rates
The breakage rate of the process significantly affects the output quantities. For that reason, there is a high focus on handling the wafers as gently as possible. Schmalz’ wafer gripper SWGm enables minimum breakage rates compared to other handling technologies. The large contact surface and low vacuum level mean that the wafer gripper generates only minimum surface pressure, making it particularly gentle.

Contamination-free handling
Contamination of the wafer surfaces must be avoided in all processes throughout the production chain. The wafer gripper SWGm with a contact surface made of contamination-free PEEK material is the optimal solution. Suction cups made oft he markless material HT1, can also be used in wafer manufacturing.

Separating the wafers
Separating the wafers places high demands on the gripping technology. The floating suction cup SBS generates a high flow rate, which is used to achieve a larger engagement distance to separate the wafers. The optional floating suction cup modules SBSm, which can be integrated into the wafer gripper SWGm, allow the advantages of the wafer gripper to be combined with the engagement distance of floating suction cups.

Handling wafers in wet bench applications
The wafer gripper SWGm wet was developed especially for handling wet wafers. The special positioning and dimensioning of the suction points allows wet wafers to be moved securely in industrial etching and cleaning processes without drying out the wafers‘ surface.

Requirements for Vacuum Technology

Short cycle times in stringing procsss
The cells are destacekd from the transport boxes and supplied to the stringing process with short cycle times. This requires both high acceleration rates and high positioning accuracy. The wafer gripper SWGm with optional integrated Bernoulli modules SBSm provides minimum gripping times and optimized cell separation. 

Gentle cell and string handling
When handling strings, it is most important to avoid damaging the cells at the edges of the busbars. Suction cups with a very soft sealing lip, such as the series SGPN, enable gentle handling. Specially designed for gentle handling at their optimal operating point, the SCPi Solar compact ejectors permit gentle and energy-efficient handling of cells. In addition, the ready-to-connect string gripper SSG was developed for handling entire strings. The gripper is equipped with suction cups and an ejector, and is available for both automated and manual handling.

High shear force on glass
Throughout the entire process chain, glass is handled dynamically with a wide variety of requirements. During loading of the line, the glass is often coated with separation powder. The suction plates SGF have a special structure on the suction area to absorb powerful shear forces even when working with suction plates coated with separation powder. In processes that require not only shear force, but also high flexibility and adaptability, the suction cups SAB with 1.5 folds are the optimum solution. Both suction cups are made of the markless material HT1.

Short cycle times and high system availability
Handling processes demand short cycle times. The SCPi/SMPi compact ejectors feature an integrated suction and blow-off function. This minimizes suction and depositing times, as well as energy consumption, since the integrated automatic air-saving function means that the ejector is only activated when vacuum is needed. The intelligent compact ejectors also feature numerous functions for energy and process control.

Automated ergonomic handling
Throughout the process chain, glass and modules are handled automatically. The modular suction spiders SSP offer a turnkey solution for automated handling, from destacking the glass plates to flashing and commissioning of the modules.

Requirements for Vacuum Technology

High shear force on glass
Throughout the entire process chain, glass is handled dynamically with a wide variety of requirements. During loading of the line, the glass is often coated with separation powder. The suction plates SGF have a special structure on the suction area to absorb powerful shear forces even when working with suction plates coated with separation powder. In processes that require not only shear force, but also high flexibility and adaptability, the suction cups SAB with 1.5 folds are the optimum solution.

Non-marking handling of glass
Once the glass sheets have been cleaned, marks absolutely must be avoided. With HT1, Schmalz has developed a material that allows glass to be handled leaving no visible marks, even at temperatures of up to 170°C. In addition to the HT1 material, suction cup covers can also be used to completely avoid any contact between the suction cup and the surface of the glass.

Short cycle times and high system availability
Handling processes demand short cycle times. The SCPi/SMPi compact ejectors feature an integrated suction and blow-off function. This minimizes suction and depositing times, as well as energy consumption, since the integrated automatic air-saving function means that the ejector is only activated when vacuum is needed. The intelligent compact ejectors also feature numerous functions for energy and process control.

Automated ergonomic handling
Throughout the process chain, glass and modules are handled automatically. The modular suction spiderSSP offer a turnkey solution for automated handling, from destacking the glass plates to flashing and commissioning the modules.

Requirements for Vacuum Technology

Gentle cell and string handling

• When handling strings, it is important to avoid damage to the cells, especially around the edges of the busbars
• Precise string handling in automated layup processes with high lateral force stability and high positioning accuracy
• Gentle gripping and depositing thanks to weight-optimized gripper with integrated valves and vacuum generator as well as bellows suction pads with soft sealing lip

For ergonomic, manual module handling

• Vacuum tube lifters Jumbo with swivel unit PSE stand for ergonomic and damage-free handling of modules and collectors
• Smooth-running aluminum crane systems enable energy-saving transport of the modules and high positioning accuracy at the same time

Handling without imprints

• Avoidance of imprints, especially before plasma coating by special wafer grippers

Low breakage rates

• Special vacuum gripper technologies are particularly characterized by minimal breakage rates compared to other handling technologies
• Thanks to large contact surfaces and a low vacuum, grippers specially developed for the solar industry generate minimal surface pressure and thus handle cells particularly gently