Vacuum Technology for the Electronics Industry

Clean and Flexible Handling

With increasing digitization and connectivity in almost every industry, not only the demand for electronic components is increasing, but also their complexity. In the automotive, consumer electronics (handsets), infrastructure and aviation sectors, for example, the demands placed on parts and components are constantly increasing. New production technologies and miniaturization are the results.

In the semiconductor sector, increasingly better and more powerful chips are manufactured, which are further processed in complex processes in the packaging sector. Due to the steadily decreasing form factor, PCB manufacturers and developers are required to generate more complex circuits and to manufacture them reliably. The high demand for electronic devices also requires manufacturers in all areas to improve their processes, increase throughput and achieve YIELD increases. Automation and information processing are part of this process. Safe and sensitive handling of components and products within the process chain are becoming increasingly important.

Vacuum technology and the associated vacuum systems make it possible to meet the requirements. Thanks to Schmalz's expertise in the field of vacuum technology and the associated knowledge of the electronics industry, Schmalz can offer the right solutions for the most advanced processes. In addition, new products are constantly being developed to meet the increasing requirements in the individual areas of semiconductor, printed circuit board and end product production.

제품 요청

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특별 혜택: 신소재 HT1-ESD로 만든 진공패드 무료 테스트하기

전자 제품 생산에서 핸들링을 최적화해야 하나요? 신소재 HT1-ESD로 만든 진공패드로 최종 제품, 소비자 가전 및 가전제품 생산의 핸들링 공정에 대한 새로운 기준을 제시하고 있습니다.

이 소재는 생산 환경으로 확산되어 유해 입자를 생성할 수 있는 중요한 첨가제나 코팅 없이도 영구적인 ESD 보호 기능을 제공하고, 최소한의 자국으로 핸들링이 가능하며, 고온 및 오존에 대한 저항성이 우수합니다.

개인 현장 상담을 포함하여 최대 20개의 시스템 테스트 샘플을 무료로 받을 수 있습니다.

지금 무료 진공패드 신청하기

Schmalz offers you the suitable solution in the electronic industry

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Vacuum Technology during the Manufacturing of Printed Circuit Boards

Vacuum Technology for Printed Circuit Board Assembly

Vacuum Technology during the Manufacturing of Printed Circuit Boards

Requirements for Vacuum Technology

The active areas of the printed circuit board are highly sensitive, therefore the PCBs are handled at the outermost edge. As a result, Schmalz recommends the use of suction cups with a diameter of less than 15 millimeters from the PFYN, FSGA or FSG product families. The use of a spring plunger for height compensation from the FSTIm product family supports safe handling. In combination with a flat suction cup like the SGON, this results in a solution that masters even the most difficult requirements and load cases.

In the field of PCB manufacturing, environmental influences should not be underestimated. Schmalz offers a wide variety of materials in combination. The product portfolio includes suction cups made of low-impression HT1 material as well as NBR-ESD material for the safe discharge of generated charges.

Thanks to the individually adaptable solutions from Schmalz, handling and process steps can be made safer and rejects minimized.

Product recommendations for Use in the Manufacturing of Printed Circuit Boards

평평한 흡입 패드 SUF

직경 : 1 ~ 30mm
자료 : NBR, NBR-ESD, SI, SI-AS, HT1
전도성, 분 산성 및 낮은 임프린트 변형

카테고리 표시

평평한 흡입 패드 SGON

치수 : 4 x 2mm ~ 30 x 10mm
재질 : HT1, NBR, NBR-AS, NBR-ESD, SI
전도성, 분 산성 및 낮은 임프린트 변형

카테고리 표시

스프링 플런저 FSTIm

모듈 식 흡입 컵 연결
스트로크 : 5 ~ 20mm
내부 댐핑 스프링
회전 잠금 장치 유무

카테고리 표시

소형 이젝터 SCPS / SCPSi

최대 67 l / min의 펌핑 속도
최대 진공 : 85 %
플라스틱으로 만들어진 본체

카테고리 표시

플로팅 흡입 컵 SBS-ESD

Diameter: 10 to 100 mm
Holding force: 1.4 to 55.5 N
Rubber buffer to protect against uncontrolled electrostatic discharge

카테고리 표시

Floating Suction Cups SBS Thin

Diameter: 20 mm
Holding force: 3.0 N
Design: flat version

카테고리 표시

스프링 플런저 FSTImc

모듈 식 흡입 컵 연결
스트로크 : 5 ~ 10mm
내부 댐핑 스프링
카트리지 버전

카테고리 표시

Vacuum Technology for Printed Circuit Board Assembly

Requirements for Vacuum Technology

Due to the diversity and countless geometries of an assembled printed-circuit board, a PCB handling solution is required that compensates for the height differences of the components while also preventing damage due to mechanical stress. Thanks to its extremely high flow rate, the Schmalz flow gripper SCG is ideal for handling circuit boards and uneven components. The sealing lip adapts to the different geometries. The partially projecting solder tags used in the THT process create height differences that can be compensated by the floating suction cup SBS (based on the Bernoulli principle), thus enabling effective handling.

Vacuum technology is used not only in the assembly process itself, but also for the component supply station ("feeder") of the pick-and-place machines. Whether for the blister tape reels ("Tape&Reel") or the tray supply: Schmalz suction cups can be used to great effect in both areas. Schmalz also offers suitable products for larger components and for provision in plastic tubes.